Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the […]

Introduction This is the second installment in a series of articles that aims to explore a range of practical topics on radiation that are relevant to those of us focused on electronics cooling and thermal design. The last article [3] […]

By Andras Poppe and Marta Rencz The 30th THERMINIC (Thermal Investigations of ICs and Systems) workshop was held on 25-27 September 2024 in Toulouse, France at the Mercure Toulouse Centre Compans. Jean-Pierre Fradin (Icam, France) and Patrick Tounsi (INSA Toulouse […]

The AIST Group (consisting of National Institute of Advanced Industrial Science and Technology (AIST) and AIST Solutions Co.) and NGK INSULATORS, LTD. (NGK) have embarked on joint research regarding validating methods for evaluating thermal diffusivity of silicon nitride ceramic substrates […]

By Serdar Ozguc, Qingyang Wang, Akshith Narayanan, Richard W. Bonner III The Need for Two-Phase Cooling in Data Centers Power usage in data centers account for 1.8% of the overall electricity expenditure in the United States [1] and the cooling […]

By Cameron Koller, Marketing Development Manager, Parker Hannifin Quick Coupling Division As technology evolves, one challenge remains constant: heat. Servers, supercomputers, and data centers generate massive amounts of heat, with power densities often reaching 10 to 20 kilowatts per rack […]